Re: Resin dust hazard?
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mbcarson2002
Dave,
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In the electronics assembly industry (as in printed circuit board assembly), a laminar flow booth or smoke extraction system is used to control fumes from the soldering process. Basically both of these things are blower systems with the intake close to the workpiece and the exhaust in a remote location. There is usually a filter in line before the exhaust to capture most of the particulates/fumes in the exhaust stream, with the idea of preventing transferring the problem to a remote location. I think you could do a poor man's smoke extraction system with a muffin fan, a furnace filter, and a couple lengths of flexible dryer vent hose. Regards, Mike Carson
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From: "Dave & Libby Nelson" <muskoka@...> To: <STMFC@...> Sent: Thursday, 17 January, 2002 01:21 Subject: RE: [STMFC] Resin dust hazard? : : : > -----Original Message----- : > From: Jeff Aley - GCD PE [mailto:jaley@...] : : > I assume that you are already familiar with Manufacturer's Safety : > Data Sheets (MSDS). If not, my (feeble) understanding is that all : > manufacturers of chemicals are required to publish an MSDS that describes : > the hazards and toxicities of their products. : > : > It may be worth your while to contact the ACC manufacturer and : > request an MSDS; you may also be able to obtain the proper MSDS from the : > resin kit manufacturers. If they are reluctant to reveal exactly which : > resin they are using, then perhaps they can obtain the MSDS for you. : : I'm becomming familiar with this information. I have a good idea of exactly : what is in the resin -- the short name is isocyanates and there is a whole : family of compounds (CAS 101-68-8: 4,4'-Methylenediphenyldiisocyanate is : typical) the choice and mix of which determine whether the resulting resin is : a foam, or hard, or soft and flexible, etc. What is befuddling tho is : everything I find about sensitivities involve either the original liquid : (a.k.a. part A in the resinators inventory) or the accidental release of : isocyanates from cured resin via application of heat. I've seen dangerous : temperature ranges cited are from a low of 150F to a high of around 400F. All : MSDS sheets comment that it's a really bad idea to have this stuff around food : (n.b., it appears the standard kit flatening recommendation of 150F in the : oven is an extremely bad idea). But again, that's the original compound. : It's supposed to be chemically inert when parts A and B are cured into the : hardened resin, released again only when heated or burned. : : As I have never done casting, nor heated kit parts, I'm wondering if it may : have been the inadvertant ingestion of dust particles from sanding (I normally : work with parts very close to my face as I wear a 7x optivisor). I'm hoping I : can control the environment well enough to allow me to continue building resin : kits. : : Dave Nelson : : : To unsubscribe from this group, send an email to: : STMFC-unsubscribe@... : : : : Your use of Yahoo! Groups is subject to http://docs.yahoo.com/info/terms/ : :
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